Keynote #1: Opportunities and Challenges of Emerging Memory in the era of all about data

Dr. Myung-Hee Na
VP Technology
SK hynix

Abstract: All over the world, our lives have forever changed in the course of the Covid-19 pandemic. We have become more and more reliant on social closeness with various technologies, while physical distancing has been enforced. Now our daily routines are virtually connected to the global world through countless devices. In result, all connected devices have been generating unprecedented amount of data. For example, AI applications have been intimately into our daily lives and new applications such as Metaverse has been realized more than just a story in sci-fi novels. In semiconductor industries, we are proud that the backbone of these technologies which has made all this possible are semiconductors. However, it is also true that these new applications have put the historical challenges and opportunities on semiconductor scaling to move faster and more efficient in terms of power-performance-area-cost.

In particular memory innovation has been recognized as one of key solutions to address the challenges in the era of all about data. It is not only important that the memory technologies deliver all the traditional values of memory such as high performance, lower power, lower cost and higher capacity, but also bring smarter solutions to bring down the barrier of memory-compute. In this talk, we will discuss the journey of memory innovation starting with the path of emerging memory technologies for new applications and then the path for ultimately breaking down the memory-compute boundaries. With the introduction of new interfaces such as Compute-Express-Link(CLX) , the journey of emerging memory technologies begins with a few research options including chalcogenide-based and ferroelectric materials for emerging memory toward better performance and process simplicity, going beyond existing industry solutions such as 3DxP. We will explore chalcogenide-based memory solutions much further toward better performance and process simplicity.

Finally this journey will merge into the path for Beyond Memory by breaking the boundary between compute and memory. At Last but not the least, we truly believes that the journey to Beyond Memory could be only possible when semiconductor industries can embrace open innovation to make a better and sustainable world together.

Biography: Dr. Myung-Hee Na is the Vice President of Research Division at SK Hynix. Currently she is responsible for leading next-generation memory technology research. Prior to joining Sk Hynix, she was the Vice President of Technology Solutions and Enablement at imec where she was responsible for CMOS technology research for advanced CMOS and AI technology. After completing her Ph.D in Physics, Dr. Na started her career at IBM in 2001, where she held various technical, managerial and executive roles until early 2019. During that time, she served as Distinguished Engineer and Technical Executive for semiconductor technology R&D. At IBM Research, she successfully led Research and Development for multiple generations of semiconductor technologies, including high-K metal gate, FinFET, and Nanosheet development. She received several IBM Awards for her technical contributions. Moreover, she has co-authored numerous research papers and holds multiple U.S. and international patents.

Keynote #2: Robustness of Automotive Embedded System – EMC & ESD From the Technology to the System

Dr. Patrice Besse
EMC & ESD Director
NXP, France

Abstract: Embedded electronics require very high levels of safety and of robustness with secure connections. The development and the qualification of transportation systems such as electrical vehicles are one of the most exciting challenges faced by the electronic industry. Electronic modules should not create disturbance and should be immune against both transient aggressions (ESD, EFT) and electromagnetic interference (EMI), keeping functions safe when ESD or EMI occur. Systems and integrated circuits should pass multiple standards and real stresses to ensure high level of quality and of robustness. An optimized and cost-effective system requires a good match between the different components of the application during EMI and ESD in a large temperature. Hence, dedicated strategies and development methods should be deployed from the technology to the system. At silicon level different types of technologies are used with specific electrical isolations, and voltage rating higher than 100V. At each development step, transient protection strategy and EMC solutions must be fully compatible together and with the rest of the application. An overview of system solutions and strategies from the technology to the system to pass harsh electromagnetic and other transient aggressions, will be presented.

Biography: After his Post-graduation in Compatibility Electromagnetic (EMC) in 2000, then Patrice has defended a PhD and joined the Analog Design Group of Freescale Toulouse, (France) as ESD engineer in 2004. In the last 20 years Patrice lead ESD & EMC performance for different businesses with a focus on automotive applications. Patrice is author of more than 30 publications with more than 40 patents granted in the field of EMC, ESD and analogue design. Since 2014, Patrice leads EMC & ESD activities within NXP, including Technologies, ESD / EMC libraries, IC design and application, Lab validation and customer support.

Keynote #3: Computer-aided design of materials and devices in the quantum-technology era

Dr. Félix Beaudoin

Abstract: Semiconductor technologies are currently undergoing multiple paradigm shifts: following extreme miniaturization of components, atomistic and quantum effects become increasingly prominent. While these features are generally considered as detrimental to conventional transistors, they become operating principles for emerging quantum technologies. In this context, it becomes imperative to develop and employ improved technology computer-aided design tools able to account for relevant atomistic and quantum effects for both classical and quantum technologies at a fundamental level. In this talk, we give an overview of such tools by presenting scientific results recently obtained with Nanoacademic’s atomistic and quantum design software. We first focus on classical semiconductor device simulations using density functional theory, non-equilibrium Green’s function, and tight binding methods. We then introduce QTCAD (Quantum-Technology Computer-Aided Design), our newly developed finite-element modeling software for the design of quantum hardware based on spin qubits in semiconductors. After explaining the technical challenges that QTCAD enables to overcome, we present recent use cases in which QTCAD led to enhanced understanding of experimental results obtained with quantum dots hosted in a standard-process 28 nm STMicroelectronics ultra-thin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FD-SOI) transistor.

Biography: Félix Beaudoin first obtained an M. Sc. in theoretical physics from Université de Sherbrooke under the supervision of Prof. Alexandre Blais, followed by a Ph.D. in theoretical physics from McGill University with Prof. William A. Coish. He then worked as a postdoctoral associate and university lecturer at Dartmouth College in the research group of Prof. Lorenza Viola, in close collaboration with the Quantum Information and Integrated Nanosystems Group led by Prof. William D. Oliver (Massachusetts Institute of Technology). He cumulates over 12 years of research experience in the field of quantum technology, with scientific interests spanning quantum noise, quantum control, quantum metrology, and modeling of spin qubits and superconducting qubits alike. He joined Nanoacademic in 2019 as a Research Scientist and is now Director of Quantum Technology with the mandate of managing the development of the QTCAD quantum modeling tool.

Keynote #4: Process developments in advanced image sensor technologies and resulting performance gains in automotive image sensors

Dr. Thomas Ayers
VP R&D Automotive Sensing
ON Semiconductor Corporation

Abstract: Image sensing technologies for automotive have made dramatic gains in performance in the last decade fueled by advancing process technology developments and innovative sensor designs. This has enabled the transition from pure viewing modalities such as backup cameras, to computational viewing modalities such as surround view to pure computational modalities such as ADAS. As the bar is raised with each new product release, we take a step back to look at progress made and yet to be made in key imaging metrics along with the process technologies that have helped to drive these metrics.

Biography: Thomas Ayers has spent three decades in the development of innovative products and processes leading and participating in the engineering development of systems, process, pixel, analog VLSI, digital SOC, firmware, software, semiconductor and systems operations. Thomas began his career in DSP software development of sonar systems for the Seawolf submarine before moving to Silicon Valley and spending a decade on development of digital video compression / digital set top box systems and semiconductors. Next Thomas developed 3D ray tracing supercomputer systems and silicon before moving on to work with Cablelabs on the development of the DOCSIS3.0 cable modem RFI specification and related semiconductor and system products which became the first commercial introductions of the technology. Thomas began working in image sensors in 2007 with startup Pixim which he later sold to SONY where he spent a decade running advanced image sensor technology development programs as the top manager of SONY’s image sensor design center (California, NY, Israel). Thomas currently holds a position as VP R&D for onsemi automotive sensing division.

Keynote #5: Artificial Intelligence Verification-The Future of Chip Verification

Nitin Kishore
Truechip Solutions

Abstract: Implementation of artificial intelligence (AI) in chip design verification is the futuristic vision of Truechip. The company has already automation and GUI tools which today is capable of automatic test bench generation, automatic environment creation and regression analysis along with performance measurement. AI coupled with Truechip’s automation tool will revolutionize the design verification. AI will bring more automation in verification. We will have superior testing and verification methods which will use the past data and use AI-ML algorithms to get robust coverage. It will also reduce time-to-market by automation and rapid impact analysis of different implementations. Coverage and Debugging is also an area which will get gigantic innovations. Stay tuned for our live presentation at ICICDT seminar to experience Truechip futuristic vision.

Biography: Over 22+ years of engineering and management experience, developing and bringing to market over 100 products. Prior to founding Truechip, Nitin was a Design Manager at Freescale Semiconductor (now NXP). Nitin worked at FSL for 10 years. Prior to that Nitin worked at ControlNet, Goa, India. Hands on experience in frontend and backend SoC design flows. Nitin holds a PGDM (Finance) from AIMA, and a BE (Electronics & Telecommunications) from Pune University, India.